Issues with v2.0

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Revision as of 14:23, 30 October 2011 by Arclight (talk | contribs) (Created page with "===Open Access Control - Issues with v1.0 and v2.0 hardware=== First off, the v2.x hardware has been very reliable and is installed at a number of locations. The system at [http...")
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Open Access Control - Issues with v1.0 and v2.0 hardware

First off, the v2.x hardware has been very reliable and is installed at a number of locations.

The system at 23b Shop has been in production for over 1 year with no issues.

There are some quirks to this system however, especially since it was designed without ever having seen a commercikal unit.

List of Things to Improve in v3.0 Hardware

  • Separate power or ground for each sensor input (1 sensors = 2 screw terminals)
  • Consistent labeling (some items start with 0, others with 1)
  • Screw terminals obscure labels of pinouts.
  • Standardize Wiegand and other pin layout and order
  • Removable screw terminals (3.5 or 5mm) desirable for servicing
  • Need to label NO, C, O for relay terminals
  • Increased separation of trace spacing near relays
  • Double ground planes need stitch vias for better immunity
  • Eliminate ground plane around external relay traces
  • Readers with <100uS pulses require external capacitors to work
  • Break out ICSP pins from Arduino
  • Consider adding an Arduino reset switch footprint
  • Grounded components hard to solder. Consider going to a grid for ground plane
  • Better regulator footprint or more spacing for heatsink
  • Need more inputs and outputs for Wiegand reader beeper, LEDs
  • Consider Arduino Mega support
  • Look at RTC crystal and pick best temperature-compensation range
  • Think about on-board Ethernet
  • Option for RS-485
  • Option for SD card for local logging. Consider file system.
  • Control costs (SMT design, cheaper components in some areas
    • Switching PSU circuit
    • Replace opto-isoloators with ESD absorbing devices. May also allow bi-directional support.
  • Consider CPU that will handle encryption
  • Design Requirements
  • Detailed Specification